 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| MC100LVEL01 3.3V ECL 4-Input OR/NOR Description The MC100LVEL01 is a 4-input OR/NOR gate. The device is functionally equivalent to the EL01 device and works from a 3.3 V supply. With AC performance similar to the EL01 device, the LVEL01 is ideal for low voltage applications which require the ultimate in AC performance. Features http://onsemi.com MARKING DIAGRAMS* 8 1 SOIC-8 D SUFFIX CASE 751 8 1 TSSOP-8 DT SUFFIX CASE 948R 8 KVL01 ALYW G 1 * 370 ps Propagation Delay * High Bandwidth Output Transitions * ESD Protection: >2 kV Human Body Model, >200 V Machine Model * The 100 Series Contains Temperature Compensation * PECL Mode Operating Range: VCC = 3.0 V to 3.8 V * NECL Mode Operating Range: VCC = 0 V * * * * * * * with VEE = 0 V with VEE = -3.0 V to -3.8 V Internal Input Pulldown Resistors Q Output will Default LOW with All Inputs Open or at VEE Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level 1 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V-0 @ 0.125 in, Oxygen Index 28 to 34 Transistor Count = 83 devices Pb-Free Packages are Available 8 KV01 ALYWG G 1 1 DFN8 MN SUFFIX CASE 506AA A L Y W M G = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 December, 2006 - Rev. 3 1 Publication Order Number: MC100LVEL01/D 3X M G G 4 MC100LVEL01 Table 1. PIN DESCRIPTION D0 1 8 VCC PIN D0-D3 Q, Q VCC VEE EP FUNCTION ECL Data Inputs ECL Data Outputs Positive Supply Negative Supply Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. D1 2 7 Q D2 3 6 Q D3 4 5 VEE Figure 1. Logic Diagram and Pinout Assignment Table 2. MAXIMUM RATINGS Symbol VCC VEE VI Iout TA Tstg qJA qJC qJA qJC qJA Tsol Parameter PECL Mode Power Supply NECL Mode Power Supply PECL Mode Input Voltage NECL Mode Input Voltage Output Current Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Thermal Resistance (Junction-to-Ambient) Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm <2 to 3 sec @ 248C <2 to 3 sec @ 260C 8 SOIC 8 SOIC 8 SOIC 8 TSSOP 8 TSSOP 8 TSSOP DFN8 DFN8 Condition 1 VEE = 0 V VCC = 0 V VEE = 0 V VCC = 0 V Continuous Surge VI VCC VI VEE Condition 2 Rating 8 to 0 -8 to 0 6 to 0 -6 to 0 50 100 -40 to +85 -65 to +150 190 130 41 to 44 5% 185 140 41 to 44 5% 129 84 265 265 Units V V V V mA mA C C C/W C/W C/W C/W C/W C/W C/W C/W C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 MC100LVEL01 Table 3. LVPECL DC CHARACTERISTICS VCC = 3.3 V; VEE = 0 V (Note 1) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 2) Output LOW Voltage (Note 2) Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current 0.5 2215 1470 2135 1490 Min Typ 15 2295 1605 Max 20 2420 1745 2420 1825 150 0.5 2275 1490 2135 1490 Min 25C Typ 15 2345 1595 Max 20 2420 1680 2420 1825 150 0.5 2275 1490 2135 1490 Min 85C Typ 17 2345 1595 Max 22 2420 1680 2420 1825 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary 0.3 V. 2. Outputs are terminated through a 50 W resistor to VCC - 2.0 V. Table 4. LVNECL DC CHARACTERISTICS VCC = 0 V; VEE = -3.3 V (Note 3) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 4) Output LOW Voltage (Note 4) Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current 0.5 -1085 -1830 -1165 -1810 Min Typ 15 -1005 -1695 Max 20 -880 -1555 -880 -1475 150 0.5 -1025 -1810 -1165 -1810 Min 25C Typ 15 -955 -1705 Max 20 -880 -1620 -880 -1475 150 0.5 -1025 -1810 -1165 -1810 Min 85C Typ 17 -955 -1705 Max 22 -880 -1620 -880 -1475 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input and output parameters vary 1:1 with VCC. VEE can vary 0.3 V. 4. Outputs are terminated through a 50 W resistor to VCC-2 volts. Table 5. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0 V or VCC = 0 V; VEE = -3.3 V (Note 5) -40C Symbol fmax tPLH tPHL tskew tJITTER tr tf Characteristic Maximum Toggle Frequency Propagation Delay to Output Within Device Skew Cycle-to-Cycle Jitter Output Rise/Fall Times Q (20% - 80%) 120 210 Min Typ TBD 310 40 TBD 225 320 120 510 100 270 Max Min 25C Typ TBD 370 40 TBD 225 320 120 470 100 290 Max Min 85C Typ TBD 390 40 TBD 225 320 490 100 Max Unit GHz ps ps ps ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. VEE can vary 0.3 V. http://onsemi.com 3 MC100LVEL01 Q Driver Device Q Zo = 50 W 50 W 50 W D Zo = 50 W D Receiver Device VTT VTT = VCC - 3.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC100LVEL01D MC100LVEL01DG MC100LVEL01DR2 MC100LVEL01DR2G MC100LVEL01DT MC100LVEL01DTG MC100LVEL01DTR2 MC100LVEL01DTR2G MC100LVEL01MNR4 MC100LVEL01MNR4G Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) Shipping 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices http://onsemi.com 4 MC100LVEL01 PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AH -X- A 8 5 B 1 S 4 0.25 (0.010) M Y M -Y- G K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 C -Z- H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MC100LVEL01 PACKAGE DIMENSIONS TSSOP-8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R-02 ISSUE A 8x K REF 0.10 (0.004) M 0.15 (0.006) T U S 2X TU S V S L/2 8 1 5 L PIN 1 IDENT 4 B -U- 0.25 (0.010) M 0.15 (0.006) T U S A -V- F DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ C 0.10 (0.004) -T- SEATING PLANE D G DETAIL E -W- DIM A B C D F G K L M http://onsemi.com 6 MC100LVEL01 PACKAGE DIMENSIONS DFN8 CASE 506AA-01 ISSUE D D A B PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 --- 0.25 0.35 E 2X 0.10 C 2X 0.10 C 0.10 C 8X 0.08 C SEATING PLANE A1 8X L K ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CCCC CCCC CCCC CCCC D2 e/2 1 8 TOP VIEW A (A3) C e 4 SIDE VIEW E2 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW http://onsemi.com 7 MC100LVEL01/D |
Price & Availability of MC100LVEL01D
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |